Accept Alternate Major:Industrial Engineering, Electrical Engineering, Materials Engineering or related engineering field
Alternate Combination of Education/ Experience:Y
Required Alternate Level of Education :Master's
Other Alternate Level of Education:
Acceptable Years of Experience:13
Accept Foreign Educationa:Y
Acceptable Alternate Occupation:Y
Acceptable Alternate Occupation Month:180
Accept Alternate Job Title:Technology Development related position involving pkging solutions for the semiconductor industry
Normal Requirements of Job Opportunity:Y
Required Foreign Language:N
Specific Skills:Position requires a Bachelors degree in Chemical Engineering, Industrial Engineering, Electrical Engineering, Materials Engineering or related engineering field plus fifteen 15 years in the job offered or in a Technology Development related position involving packaging solutions for the semiconductor industry. Alternately, will accept a Masters degree in Chemical Engineering, Industrial Engineering, Electrical Engineering, Materials Engineering or related engineering field plus thirteen 13 years of experience in the job offered or in a Technology Development related position involving packaging solutions for the semiconductor industry, or a Ph.D. degree in Chemical Engineering, Industrial Engineering, Electrical Engineering, Materials Engineering or related engineering field plus nine 9 years of experience in the job offered or in a Technology Development related position involving packaging solutions for the semiconductor industry. Position requires nine 9 years of experience in the following Technical program management; Working with external customers on development projects; Handson experience working on OSAT process in Asia and US or Europe; Advanced Packaging; Generating qualification plan, including test vehicle description, test vehicle, DOE matrix and product quantities, reliability stresses, cost, timeline; Working with vendor quotes for product packages, including unit cost, NRE, timeline, and special circumstances such as cooperative development; Overall planning including upstream and downstream flow to packaging assembly schedule and technical implications such as substrate, Fab, and Final test; and Working with a semiconductor foundry. Position requires three 3 years of experience working with both RF or ASICs applications for packaging. Position requires experience with the following Working with development, NPL, Business Unit, and program management including Flipchip BGA, FCCSP, WLCSP, or Wirebond packages both Leadframe and Laminate; Packaging product life cycle from feasibility, customer bid, development, and NPI management, including documentation, multifunction team management at each stage and risk assessments; Generating and reviewing Quality Systems including 8D, Control Plans, FMEA, Problem Solving Methodology, and Statistical Analysis; Working on IFX and automotive programs; Working with advance packages such as PBGA, FCBGA, FCCSP, WLCSP, sccsp and QFN; Customer and conflict management; Assembling and leading a team to address all semiconductor package features; and Discussing package technology with customers and internal customer interface team.br br Employer will accept any suitable combination of education, experience, and training.
Combination Occupation :N
Offered to Applied Foreign Worker:Y
ForeignWorker Live on Premises :N
Live in Domestic Service Worker:N
Employment Contract :
Professional Occupation :Y
College/ University Teacher:N
Competitive Process:
Basic Recruitment Process :
Teacher Select Date:
Teacher Publish Journal Name:
Additional Recruitment Information:
Job Oder Start Date:2020-06-26
Job Oder End Date:2020-07-30
Sunday Edition Newspaper:Y
First Newspaper Name:Burlington Free Press
First Advertisement Start Date:2020-07-12
Second Newspaper Name:Burlington Free Press
Second Advertisement Type:Newspaper
Second Ad Start Date:2020-07-19
Job Fair From Date:
Job Fair to Date:
On Campus Recruiting from Date:
On Campus Recruiting to Date:
Employer Website from Date:2020-06-26
Employer Website to Date:2020-08-26
Pro. Org. Ad from Date:
Pro.Org. Ad to Date:
Job Search Website from Date:2020-07-12
Job Search Website to Date:2020-07-19
Private Employment Firm from Date:
Pricate Employment Firm to Date:
Employee Referral Program from Date:
Employee Referral Program to Date:
Campus Placement from Date:
Campus Placement to Date:
Local Ethnic Newspaper from Date:2020-07-22
Local Ethnic Newspaper to Date:2020-07-29
Radio/TV Ad from Date:
Radio/TV Ad to Date:
Employer Received the Payment:N
Payment Details:
Bargaining Representative Notified:N/A
Posted Notice at Worksite:Y
Layoff in Past Six Months:N
US Worker Considered:
Country of Citizenship:PHILIPPINES
Foreign Worker Birth Country:PHILIPPINES
Class of Admission :L-1
Employee Info
Foreign Worker Education:Bachelor's
Foreign Worker Education Other:
Foreign Worker Major:CHEMICAL ENGINEERING
Year of Compelted Education:1998
Foreign Worker Istitution of Eduation:UNIVERSITY OF SANTO TOMAS
Foreign Worker Education Instution Address Line 1:ESPANA BLVD.
Foreign Worker Education Institution Address Line 2:
